DDR Products
Compact and rugged BGA memory devices for size, weight and power (SWaP) constrained applications
Compact and rugged BGA memory devices for size, weight and power (SWaP) constrained applications
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High-density DDR memory that maximizes processing performance in the most challenging environments.
Mercury’s compact plastic BGA packages consisting of multiple stacked die are optimized for size, weight and power in military and commercial aerospace applications.
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Type | Size | Organization | Part Number | Data Rate | Voltage (V) | Package | Dimensions |
---|---|---|---|---|---|---|---|
DDR4 | 8GB | 1Gx72 | 4N1G72T-XB2X | 1333-2400 | 1.2 | 321 PBGA | 13mm x 20mm |
DDR4 | 4GB | 512Mx72 | 4N512M72T-XB2X | 1333-2400 | 1.2 | 321 PBGA | 13mm x 20mm |
Type | Size | Organization | Part Number | Data Rate | Voltage (V) | Package | Dimensions |
---|---|---|---|---|---|---|---|
DDR3 | 8GB | 1GBx72 | W3J1G72KT-XLBX | 800-1600 | 1.35 | 543 PBGA | 23mm x 32mm |
DDR3 | 4GB | 512Mx64个 | W3J512M64X-XLB2X | 800-1600 | 1.35 | 543 PBGA | 23mm x 32mm |
DDR3 | 4GB | 512Mx72 | W3J512M72K-XLB2X | 800-1600 | 1.35 | 543 PBGA | 23mm x 32mm |
DDR3 | 4GB HD | 512Mx72 | W3J512M72K(T)-XHDX | 800-1600 | 1.35 | 399个PBGA | 14mm x 21.5mm |
DDR3 | 2GB | 512Mx32 | W3J512M32X-XB3X | 800-1600 | 1.35 | 136 PBGA | 10mm x 14.5mm |
DDR3 | 2GB | 512Mx32 | W3J512M32X(T)-XB3X | 800-1333 | 1.35 | 204 PBGA | 10mm x 14.5mm |
DDR3 | 1GB | 128年mx72 | W3J128M72X-XLBX | 800-1600 | 1.35 | 375 PBGA | 21.5mm x 20.5mm |
DDR3 | 1GB | 128Mx64 | W3J128M64X-XLBX | 800-1600 | 1.35 | 375 PBGA | 21.5mm x 20.5mm |
Type | Size | Organization | Part Number | Data Rate | Voltage (V) | Package | Dimensions |
---|---|---|---|---|---|---|---|
DDR2 | 512MB | 64Mx64 | W3H64M64E-XBX | 400-667 | 1.8 | 208 PBGA | 16mm x 22mm |
DDR2 | 512MB | 64Mx72 | W3H64M72E-XBX | 400-667 | 1.8 | 208 PBGA | 16mm x 22mm |
DDR2 | 256MB | 32Mx72 | W3H32M72E-XBX | 400-667 | 1.8 | 208 PBGA | 16mm x 20mm |
DDR2 | 256MB | 32Mx64 | W3H32M64E-XBX | 400-667 | 1.8 | 208 PBGA | 16mm x 20mm |
DDR2 | 256MB | 2x64Mx16型 | W3H264M16E-XBX | 400-667 | 1.8 | 79 PBGA | 11mm x 14mm |
DDR2 | 256MB | 2x64Mx16型 | W3H264M16E-XB2X | 400-667 | 1.8 | 79 PBGA | 11mm x 14mm |
DDR2 | 128MB | 64Mx16 | W3H64M16E-XB2X | 400-667 | 1.8 | 79 PBGA | 11mm x 14mm |
DDR2 | 1GB | 128年mx72 | W3H128M72E-XNBX | 400-667 | 1.8 | 208 PBGA | 16mmx22mm |
DDR2 | 1GB | 128年mx72 | W3H128M72E-XSBX | 400-667 | 1.8 | 208 PBGA | 16mm x 22mm |
DDR2 | 1GB | 128年mx72 | W3H128M72ER-XNBX | 400-667 | 1.8 | 255 PBGA | 21mm x 23mm |
Type | Size | Organization | Part Number | Data Rate | Voltage (V) | Package | Dimensions |
---|---|---|---|---|---|---|---|
DDR | 512MB | 64Mx72 | W3E64M72S-XBX | 200-266 | 2.5 | 219 PBGA | 32mm x 25mm |
DDR | 256MB | 32Mx64 | W3E32M64S-XB3X型 | 200-333 | 2.5 | 208 PBGA | 13mm x 22mm |
DDR | 256MB | 32Mx72 | W3E32M72S-XB3X | 200-333 | 2.5 | 208 PBGA | 13mm x 22mm |
DDR | 256MB | 32Mx72 | W3E32M72S-XBX | 200-333 | 2.5 | 219 PBGA | 32mm x 26mm |
DDR | 256MB | 32Mx72 | W3E32M72SR-XBX | 200-266 | 2.5 | 208 PBGA | 13mm x 22mm |
DDR | 256MB | 32Mx64 | W3E32M64S-XB2X | 200-333 | 2.5 | 219 PBGA | 21mm x 21mm |
DDR | 256MB | 32Mx64 | W3E32M64SA-XB2X | 200-333 | 2.5 | 219 PBGA | 21mm x 21mm |
DDR | 128MB | 64Mx16 | W3E64M16S-XBX | 200-333 | 2.5 | 60 PBGA | 10mm x 12.5mm |
In this webinar, discover how to address memory design challenges at the sensor edge with modern...
Processing large volumes of data in rugged environments away from climate-controlled data centers...
Compact and rugged DDR memory components for SWaP-constrained applications
从军用级固态硬盘到密集DDR,也不是闪存等等,我们的指南将帮助您选择。。。