Microelectronic Components

System-in-package solutions, memory and solid-state drives purpose-built for operation at the edge

的增加需要更多的数据处理ssed at the sensor for rapid decision-making, modern commercial and defense applications require high-density, high-performance microelectronics in small form factors.

Our compact, ruggedized microelectronics overcome size, weight and power challenges with low-latency processing and significant space savings for operation in harsh environments at the tactical edge.


Fast, Flexible and Built for Purpose

The power of our game-changing chiplet technology, coupled with our next-generation trusted microelectronics capabilities, provides up to 75% reduction in lead time, thousands of customizable configurations and reliable performance.